IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies – Challenge Testing

Course Overview

This course is designed for those candidates who are sufficiently confident in their existing knowledge and skills to restore the functionality of electronic assemblies and printed circuit boards. Companies supporting the re-certification of their staff on this can expect to see continued, significant cost savings by applying the Standard and competently repairing and reworking assemblies PCBs. The course content includes procedural requirements, tools, materials and industry-approved techniques for removing, replacing and reworking surface mount and through-hole components, as well as conductor and laminate repair.

What you Study

  • Module 1: General Requirements (prerequisite)
  • Module 2: Splicing
  • Module 3: Through-Hole Removal and Reinstallation
  • Module 4: Chip and MELF Components
  • Module 5: SOIC and SOT Removal and Reinstallation
  • Module 6: J-Lead and Gull Wing Removal and Reinstallation
  • Module 7: Jumper Wire Installation and Conductor Repair
  • Module 8: Laminate Repair
  • Module 9: Conformal Coating Rework 

Duration and Attendance

  • 1 day
  • 0900-1630
  • Glenrothes Campus

Entry Requirements

Candidates will possess a high level of knowledge and skill in relation to reworking, modifying and repairing assemblies and PCBs to a high standard, and must already hold current and vaild CIS certification.

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