COURSE INFORMATION

  • Module 1: General Requirements (prerequisite)
  • Module 2: Splicing
  • Module 3: Through-Hole Removal and Reinstallation
  • Module 4: Chip and MELF Components
  • Module 5: SOIC and SOT Removal and Reinstallation
  • Module 6: J-Lead and Gull Wing Removal and Reinstallation
  • Module 7: Jumper Wire Installation and Conductor Repair
  • Module 8: Laminate Repair
  • Module 9: Conformal Coating Rework 
  • 3 days
  • 0900-1630
  • Glenrothes Campus

Ideally, candidates will have been reworking, modifying and repairing assemblies and PCBs to a high standard, recently, and must already hold current and valid CIS certification.