COURSE INFORMATION

This course is designed for those candidates who are sufficiently confident in their existing knowledge and skills to produce high-quality soldered interconnections that they can attempt the relevant IPC tests without the need for significant Instructor input.

The course covers the materials to be used, methods to be adopted and verification criteria to be applied in order to produce high quality soldered joints. Basic soldering techniques are explained, as are relevant factors such as flux, solder composition, soldering to terminals, through-hole, surface-mount devices and relevant inspection.

Acceptance criteria are also fully covered. The course includes practical elements including work on plated through hole components and surface mount devices in order to validate inspection to the IPC J-STD-001.

H Version

Module 1

  • General Requirements
  • Applicable Documents
  • Materials Component Equipment
  • General Soldering and Assembly Requirements
  • Cleaning and Residue Requirements
  • Rework and Repair

Module 2              

  • Wire and Terminal Connections

Module 3             

  • Printed Board Requirements
  • Coating Encapsulation and Staking
  • Witness Stripes

Module 4                

  • Through-hole Mounting and Terminations
  • Jumper wires

Module 5                

  • Surface Mounting of Components
  • Jumper wires

Module 6                

  • Inspection Methodology
  • 1 day
  • 0900-1630
  • Glenrothes Campus

Candidates will possess a high level of knowledge and skill, be regularly producing high-quality soldered interconnections and must already hold current and valid CIS certification.