This course is designed for those candidates who are sufficiently confident in their existing knowledge and skills to produce high-quality soldered interconnections that they can attempt the relevant IPC tests without the need for significant Instructor input.

The course covers the materials to be used, methods to be adopted and verification criteria to be applied in order to produce high quality soldered joints. Basic soldering techniques are explained, as are relevant factors such as flux, solder composition, soldering to terminals, through-hole, surface-mount devices and relevant inspection.

Acceptance criteria are also fully covered. The course includes practical elements including work on plated through hole components and surface mount devices in order to validate inspection to the IPC J-STD-001.

H Version

  • Module 1 - Overview of J-STD-001 requirements and general requirements
  • Module 2 - Requirements applicable to the assembly and soldering of Wires and Terminals
  • Module 3 - Requirements applicable to the assembly and soldering of Through Hole connections
  • Module 4 - Requirements applicable to the assembly and soldering of Surface Mount components
  • Module 5 - Theory and application of Inspection Techniques
  • 1 day
  • 0900-1630
  • Glenrothes Campus

Candidates will possess a high level of knowledge and skill, be regularly producing high-quality soldered interconnections and must already hold current and valid CIS certification.